研究了TUMAl0.2的组织与性能。结果表明:采用内氧化方法生产的TUMAl0.2, 在纯铜基体上生成弥散、小于10 nm的γ-Al2O3微粒,加工状态的室温强度Rm可达到 610 MPa,在1173 k退火1.5 h后,强度达到室温强度的83%,表明其软化温度高于1173 K。在1273 K、1.5 h退火的晶粒平均直径小于1μm,Al2O3微粒不发生固溶、聚集、长大现象。材料导电率约90%IACS,比纯铜导电率约低10%。 The organization and properties of TUMAl0.2 were studied. The results show that TUMAl0.2 produced by the internal oxidation method can produce γ-Al2O3 particles with dispersion of less than 10 nm on the pure copper substrate. The Rm at room temperature can reach 610 MPa. After annealing at 1173 k for 1.5 h, Reaching 83% of the room temperature strength, indicating that the softening temperature is higher than 1173 K. The average diameter of the grains annealed at 1273 K and 1.5 h was less than 1 μm, and the Al2O3 particles did not solid solution, aggregate and grow up. The conductivity of the material is about 90% IACS, about 10% lower than the conductivity of pure copper.