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用对甲基苯胺对双氰胺进行改性,制备了一种新型的改性双氰胺固化剂,对合成条件进行了优化,并对其固化环氧树脂条件进行了研究。结果表明,对甲基苯胺改性双氰胺的较佳工艺条件为对甲苯胺和水的物质的量比定为1∶1.5,双氰胺和苯胺的物质的量比为1∶1,转速为一档,于90℃,反应3h,收率85%。通过测试涂层硬度来考察固化工艺与性能。作为环氧树脂固化剂单独使用时,固化温度为110℃,比双氰胺体系固化温度160℃降低了近50℃,对甲基苯胺改性双氰胺固化温度高于120℃时,涂膜硬度大于双氰胺固化温度为160℃时涂膜硬度。
A new type of modified dicyandiamide curing agent was prepared by modifying dicyandiamide with p-methylaniline. The synthesis conditions were optimized and the curing conditions of epoxy resin were also studied. The results showed that the optimum conditions for p-methylaniline modified dicyandiamide were as follows: the molar ratio of p-toluidine and water was 1: 1.5, the ratio of dicyandiamide to aniline was 1: 1, As a file, at 90 ℃, the reaction 3h, yield 85%. Test the curing process and properties by testing the coating hardness. When used alone as the epoxy resin curing agent, the curing temperature is 110 ℃, which is 50 ℃ lower than the curing temperature of dicyandiamide system at 160 ℃. When the curing temperature of p-methylaniline modified dicyandiamide is above 120 ℃, Hardness is greater than dicyandiamide curing temperature of 160 ℃ coating hardness.