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采用波长为1070 nm的光纤激光对蓝宝石基片进行切割加工。研究了蓝宝石基片切割过程中,蓝宝石基片下表面产生粉末物质和崩边的原因,并分析了激光加工工艺参数(激光能量密度、切割速度、重复频率、辅助气体压力)与蓝宝石基片上下表面崩边尺寸的关系。研究结果表明:光纤激光与蓝宝石之间的相互作用主要是光热作用,蓝宝石材料吸收激光能量后发生熔化、气化现象。同时,伴随辅助气体N2被击穿后产生的等离子体对激光的吸收,在蓝宝石内部出现了钥匙孔现象,钥匙孔的长度对切割质量有较大的影响。综合考虑激光切割蓝宝石基片工艺参数以及辅助气体压力等因素,激光能量密度为5.7×103J/cm2、切割速度为6 mm/s、重复频率为1.8 k Hz、N2压力为0.9 MPa时,获得了厚度为0.31 mm的蓝宝石基片,上表面崩边为3 mm,下表面崩边为8 mm。
The sapphire substrate is cut with a fiber laser at a wavelength of 1070 nm. In this paper, the reason why the sapphire substrate is formed on the lower surface during the sapphire substrate cutting process is studied. The effects of laser processing parameters (laser energy density, cutting speed, repetition frequency and auxiliary gas pressure) The surface of the collapse of the relationship between the size. The results show that the interaction between fiber laser and sapphire is mainly photothermal, and sapphire material melts and gasifies after absorbing laser energy. At the same time, with the absorption of the laser generated by the plasma after the breakdown of the auxiliary gas N2, a keyhole appears inside the sapphire, and the length of the keyhole has a great influence on the cutting quality. Considering the laser cutting sapphire substrate parameters and auxiliary gas pressure and other factors, the laser energy density of 5.7 × 103J / cm2, the cutting speed of 6 mm / s, the repetition frequency of 1.8 k Hz, N2 pressure of 0.9 MPa, obtained A sapphire substrate with a thickness of 0.31 mm has a 3 mm upper edge and an 8 mm lower edge.