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在无铅BGA封装工艺过程中,通过不同组分的BGA焊球合金与焊膏合金组合焊接、焊膏助焊剂活性剂不同配比及其不同再流焊接条件等实验,对焊料合金和助焊剂配比、再流焊接峰值温度、再流保温时间等参数变化,以降低BGA焊点空洞缺陷进行了研究。结果表明选用相同或相似的BGA焊球和焊膏合金组合焊接、选用活性强的焊膏、选择焊接保温时间较长均有助于降低BGA焊点空洞缺陷产生的几率和空洞面积,BGA焊点最佳再流焊接峰值温度为240℃,当峰值温度设置为250℃时,BGA焊点产生空洞缺陷几率会比240℃高出25%～30%。
In the process of lead-free BGA package, BGA solder ball alloy with different components, solder paste alloy combination welding, different proportion of solder paste flux active agent and their different reflow soldering conditions were tested on the solder alloy and flux Ratio, reflow peak temperature, reflow time and other parameters to reduce the BGA solder joint hole defects were studied. The results show that using the same or similar BGA solder balls and solder paste alloy combination welding, the selection of a strong activity solder paste, choose a longer welding holding time will help reduce the probability of BGA solder joint hole defects and void area, BGA solder joints The optimum reflow soldering peak temperature is 240 ° C. When the peak temperature is set to 250 ° C, the probability of void defects in BGA solder joints will be 25% -30% higher than 240 ° C.