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三、防止功率器件热烧毁对于大功率器件,热烧毁引起的早期失效比较严重,我们把二次击穿导致的热损坏及有关的金属电极熔融称为热烧毁。这里对大功率管防止热烧毁的设计考虑作一介绍。 1.散热考虑功率管的总热阻θ,包括与芯片几何尺寸有关的芯片热阻θ_i、管芯到管壳的热阻θ_(ic)、管壳到衬架的热阻θ_(C-MS)、衬架到散热器热阻θ_(MSHS),以及散热器到空气的传导热阻θ_(HS-A_((C)))和幅射热阻θ_(HS-A_((R))),见图7—23。通常芯片到管壳的热阻θ_(ic)是主要的。
Third, to prevent thermal destruction of power devices For high-power devices, thermal destruction caused by early failure is more serious, we put the second breakdown caused by thermal damage and the related metal electrode melting called thermal burn. Here to prevent the thermal power tube design considerations for an introduction. 1. Thermal Considerations The total thermal resistance θ of the power tube, including the thermal resistance θ_i of the die relative to the die geometry, the die-to-case thermal resistance θ_ (ic), the thermal resistance of the package to the die holder θ_ (C-MS ), The thermal resistance θ_ (MSHS) of the liner to the radiator, and the conduction heat resistance θ_ (HS_A_ ((C))) and the radiation thermal resistance θ_ (HS_A_ ((R))) from the radiator to the air , See Figure 7-23. The typical chip to package thermal resistance θ_ (ic) is the main.