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在真空镀膜设备中,电子束蒸发源虽远较电阻加热式蒸发源复杂,但因其能蒸镀难熔材料,膜层纯度高,而优于电阻加热蒸发源。到七十年代中期,磁偏转电子束蒸发源蒸镀提高了淀积率,并克服了环形枪蒸镀时易发生气体放电、功率较小,以及直枪式蒸发源占用空间大,x射线二次电子损伤大的缺点,而获得广泛的应用,特别在集成电路工艺中应用,达到了很好的效果。使用多坩埚电子束蒸发源,可以在一次抽真空的过程中镀制多层膜或合金膜。
In the vacuum coating equipment, the electron beam evaporation source is far more complex than the resistance heating evaporation source, but because of its ability to evaporate refractory materials, the membrane layer has high purity and is superior to the resistance heating evaporation source. By the mid-seventies, magnetic deflection electron beam evaporation source deposition increased deposition rate, and overcome the annular gun vapor deposition prone to gas discharge, power is small, and the direct gun evaporation source occupies a large space, x-ray two Time electronic damage the shortcomings, and access to a wide range of applications, especially in the integrated circuit technology used to achieve good results. Using a multi-crucible electron beam evaporation source, multiple layers of films or alloy films can be plated during a vacuum.