模拟CSP Hi-B钢（/%：0.05C,0.20Mn,3.47Si,0.001 5S,0.007P,0.027Al,0.006 0N）窄带制造流程为25 kg真空感应炉熔炼-浇铸成40 mm×8......

在实验室中采用无抑制剂法制备取向硅钢,并采用XRD、TEM等方法对无抑制剂取向硅钢冷轧和初次再结晶阶段的微观组织与织构进行了研......

在实验室中采用无抑制剂法制备取向硅钢,利用XRD、TEM等方法研究了冷轧和初次再结晶阶段的微观组织与织构。结果表明,冷轧板织构主......

试验研究了取向硅钢（/%：0.046C,3.07Si,0.09Mn,0.029P,0.004S,0.005 Al,0.001Ti,0.001 40,0.009 6N）2.66 mm热轧板1 100℃2 min空冷10......

取向硅钢被广泛应用在电子、电力和军事工业中,是一种不可或缺的软磁材料,其制造工艺严苛复杂、工序长、耗能高,代表着一个国家特......

对无抑制剂取向硅钢不同压下率下初次再结晶退火后的显微组织、宏观织构和微观织构进行了研究。结果表明,冷轧板织构主要为α取向......

以实验室模拟CSP连铸连轧工艺制备的热轧硅钢为基板,通过实验室常化、冷轧和初次再结晶退火实验,采用XRD和EBSD技术对样品从热轧到......

在实验室用模拟CSP工艺试制Hi-B高磁感取向硅钢薄板（/%：0.07C,3.02Si,0.13Mn,0.020P,0.006S,0.21Cu,0.025Cr,0.016A1,0.004Sn）,该钢经......