The distribution of SiC particles in AI-SiC composite can greatly influence the mechanicalperformances of AI-SiC composi......

介绍了几种微电子新型封装材料,如LTCC、AIN、金刚石、AI-Sic和无铅焊接材料等,论述了正在发展中的新型先进封装技术,如WLP、3D和S......