前言以半导体芯片为主体的微组装技术使电路的集成度大大提高,并且使电路功能更为复杂与完善。厚膜多层电路是微组装技木中一种主要的电路形式,应用广泛。布线设计是多层电路试制与生产的关键工序,有必要研究实用的布线技术,加快试制和生产的进程,提高电路性能。本文主要从实用的观点 Preface The semiconductor chip as the main micro-assembly technology to greatly improve the integration of the circuit, and to make the circuit function more complex and perfect. Thick-film multi-layer circuit is a micro-assembly technology in a major form of circuit, widely used. Wiring design is the key process of trial production and production of multilayer circuit. It is necessary to study the practical wiring technology, speed up the process of trial production and production, and improve the circuit performance. This article mainly from the practical point of view