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采用纳米压痕技术对无铅焊点(Sn3.0Ag0.5Cu、Sn0.7Cu和Sn3.5Ag)及其内部界面金属间化合物(intermetallic compound,IMC)的力学性能进行测试。根据实际工业工艺流程制备无铅焊点试样;利用接触刚度连续测量(CSM)技术对焊点及内部IMC层进行测试,得到IMC层及无铅焊点的弹性模量、硬度等力学性能参数,并根据载荷-位移曲线的保载阶段确定蠕变应力指数。结果表明,Sn0.7Cu的IMC层的弹性模量和蠕变应力指数为无铅焊点的2.03和6.73倍;对无铅焊点的可靠性评估中,将IMC层的影响考虑进去使得结果更为合理。
The mechanical properties of lead-free solder joints (Sn3.0Ag0.5Cu, Sn0.7Cu and Sn3.5Ag) and their intermetallic intermetallic compounds (IMC) were tested by nanoindentation. The samples of lead-free solder joints were prepared according to the actual industrial process flow. The solder joints and the inner IMC layer were tested by continuous contact stiffness measurement (CSM) technology to obtain the mechanical properties such as elastic modulus and hardness of IMC layer and lead-free solder joints , And the creep stress index is determined according to the load-hold phase of the load-displacement curve. The results show that the elastic modulus and creep stress index of the Sn0.7Cu IMC layer are 2.03 and 6.73 times that of the lead-free solder joint. In evaluating the reliability of the lead-free solder joint, the influence of the IMC layer is taken into account so that the result is more Reasonable.