3.15提高成品率根据2011年版路线图重新划定的章节范围,“提高成品率”一章目前包括“晶圆环境与污染控制”(WECC)和“鉴定、检测和分析”(CIA)两个子章节。因此,提高成品率的活动都集中在这两个方面。根据表YE2,关键挑战在原则上保持不变。只是在某些情况下,为了表达清晰而有措辞上的修改。短期内在大于16 nm尺度上的最重要的关键挑战估计是小产量限制缺陷检测及其免滋扰识别。探测和 3.15 Increasing the yield According to the section on redrawing the 2011 roadmap, the chapter “Increasing the yield” now includes the WECC and the “Identification, Testing and Analysis” (CIA) two sub-chapters. Therefore, the activities to improve the yield are focused on these two aspects. According to Table YE2, the key challenges remain unchanged in principle. Only in some cases, in order to express a clear and wording changes. In the short term, the most important key challenge at scales greater than 16 nm is estimated to be small-yield-limiting defect detection and its nuisance-free identification. Detect and