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针对高功率、高封装和较大出光面积的UV-LED固化灯进行水冷散热,在保证较大出光功率的同时满足芯片对结温的要求。选用S形板管式水冷板对LED模块进行散热,运用CFD软件对冷板进行数值计算,得出各个芯片的温度分布及冷板内部的流动情况。根据得到的数值模拟结果对所设计的冷板在不同的工况下进行试验,得出LED模块结温及冷板综合换热性能,并对实验结果和数值模拟结果进行对比。经过多次试验发现所设计的冷板能够满足UV-LED的散热需求,并证明数值计算具有较高的可靠性。
For high power, high package and a large area of UV-LED curing light water cooling, while ensuring a larger output power at the same time meet the chip junction temperature requirements. The S-shaped panel water-cooled panel is used to dissipate the LED module. The CFD software is used to calculate the temperature of the cold plate, and the temperature distribution and the flow inside the cold plate are obtained. According to the numerical simulation results obtained, the designed cold plate is tested under different operating conditions, and the junction temperature of the LED module and the overall heat exchange performance of the cold plate are obtained. The experimental results and the numerical simulation results are compared. After several experiments, it was found that the designed cold plate can meet the heat dissipation requirement of UV-LED and prove that numerical calculation has high reliability.