用极薄的砂轮切割硅片在半导体工业中早就得到了应用,其特点已为人们所注目。但是能充分发挥砂轮性能的切割装置目前还没有问世。砂轮和机械正如车的两个轮子一样,缺少哪一个都没有使用价值。所以,将砂轮、机械、切割技巧三者合为一体,在通盘考虑的基础上去研制砂轮切割装置才是当务之急。 Cutting the silicon wafer with a very thin grinding wheel has long been used in the semiconductor industry, and its characteristics have attracted the attention of people. However, the cutting device that gives full play to the performance of the grinding wheel has not yet come out. Wheels and machinery Just like the two wheels of a car, none of them are useless. Therefore, the grinding wheel, machinery, cutting skills of the three together, based on a comprehensive consideration to develop a wheel cutting device is a top priority.