文章介绍了一种用于低成本T/R组件的多层微波复合基板,并给出了两种采用该基板形式实现的三维微波传输电路,详细阐述了其设计方法及实现过程,并通过实物制作和测试验证了其性能指标。这两种电路具有屏蔽性好、驻波小、实用性强等优点。目前该电路已在Ku波段低成本T/R组件中得到了良好的应用。 This paper introduces a multi-layer microwave composite substrate for low-cost T / R module, and gives two kinds of three-dimensional microwave transmission circuit realized by using the substrate. The design method and implementation process are described in detail. Production and testing verified its performance. These two circuits have good shielding, low standing wave, practicality and so on. This circuit has now been well used in Ku-band low-cost T / R components.