本文提出在MOS 集成电路的中测过程中,应用给芯片衬底加电压或脉冲信号的方法,随时可以准确有效地检查探针同芯片引出点的接触情况。还对这方法的适用范围进行了讨论,针对不同情况介绍了实用方案,并指出了在实用中值得注意的细节。 This paper puts forward the method of applying voltage or pulse signal to the chip substrate during the middle measurement of MOS integrated circuit and can check the contact between the probe and the chip at any time accurately and effectively. The scope of application of this method was also discussed, practical solutions were introduced for different situations and some notable details in practice were pointed out.