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钨铜复合材料因具有优异的电、热性能,而被广泛地用作电接触、电子封装和热沉材料。在综述钨铜复合材料基本特征和应用范围的基础上,重点介绍了钨铜复合材料的制备工艺及其新体系的发展现状,并提出了钨铜复合材料现今面临的主要问题和解决方法。
Tungsten-copper composites are widely used as electrical contacts, electronic packages and heat sinks due to their excellent electrical and thermal properties. Based on the review of the basic characteristics and application range of tungsten-copper composites, the preparation process of tungsten-copper composites and the development of new systems are introduced emphatically. The main problems and solutions to the current problems of tungsten-copper composites are put forward.