日本大阪大学产业科学研究所开发成功一种散热性和加工性优良的高集成电路用散热板材料──碳化硅／铝复合材料。传统的散热板用碳化硅－铝复合材料是由承担散热作用的铝２０％与具有和电路板氧化铝热膨胀系数相同的碳化硅８０％所组成，这种散热板的硬度与陶瓷材料一样，所以 Institute of Industrial Science and Technology, Osaka University, Japan Successful development of a highly heat-dissipating and highly processable heat sink material for high integrated circuits ─ ─ silicon carbide / aluminum composite materials. Conventional heatsink with silicon carbide - aluminum composite material is responsible for the role of heat by 20% of aluminum and has the same thermal expansion coefficient of silicon oxide board with 80% of the silicon carbide, the hardness of such heatsink plate and ceramic materials, so