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当今散热技术的发展趋势更多地取决于电子产品的演变,而不是热控制技术本身的进展。散热方案的发展是革新性的,而不是革命性的——散热片的选择、界面材料的选择以及风扇的安放比过去的要求更为严格,但它们在热设计中的基本地位并没有改变。 减小线宽以及对基片采用钢连接等措施可以在不明显增加散热量的情况下提高芯片的速度,而其它方法则对散热提出了更高的要求。例如,所谓“超频”技术——一种最终用户使芯片运行于超过标称频率的趋势——正在成为芯片制造商们提供更高速芯片的方式之一,它能比技术进步方式更快地提供高速芯片。为了在不改进技术和不牺牲可靠性的前提下提高芯片速度,这些制造商们采取了降低最高工作温度的办法,这样就增加了对热管理的需求。
The current trend of cooling technology is more dependent on the evolution of electronic products, rather than the progress of thermal control technology itself. Thermal solutions are revolutionary, not revolutionary - the choice of heatsink, the choice of interface materials, and the placement of fans are more demanding than in the past, but their basic design in thermal design has not changed. Reducing the line width and the use of steel connections to the substrate can increase the speed of the chip without significantly increasing the heat dissipation, while other methods place higher demands on the heat dissipation. For example, the so-called “overclocking” technology - an end user trend to run chips beyond nominal frequency - is becoming one of the ways that chipmakers can offer faster chips that can deliver faster than technologically advanced ones High-speed chip. To increase chip speed without improving technology and sacrificing reliability, these manufacturers have taken the approach of lowering the maximum operating temperature, which adds to the need for thermal management.