为了能够比较真实地模拟微机电器件侧面摩擦副之间的摩擦磨损状况,进而对M EM S器件的摩擦学规律进行研究,设计了一种基于单晶硅材料的片上微摩擦测试机构。利用微机械体硅工艺及键合技术,把系统中的测试机构、加载机构以及力传感器集成在一个单一的芯片上。对结构的临界驱动电压、静态摩擦力及正压力进行了理论推导。最后,在显微镜下对该机构的静态摩擦因数进行了测试。测试结果表明:随着施加在摩擦副上的正压力的增加,摩擦因数相应减小。 In order to be able to simulate the friction and wear state between the friction pairs on the side of the MEMS device and to study the tribology rules of the MEMS device, an on-chip micro-friction testing mechanism based on the monocrystalline silicon material was designed. The use of micro-mechanical silicon technology and bonding technology, the system test mechanism, loading mechanism and force sensor integrated in a single chip. The critical driving voltage, static friction and positive pressure of the structure are theoretically deduced. Finally, the static friction factor of the mechanism was tested under a microscope. The test results show that the friction coefficient decreases with the increase of the positive pressure applied to the friction pair.