1.绪言在集成电路和大规模集成电路的生产工序上,需要测量圆片和掩模板上形成的微细图形的尺寸。一方面需要判断这种测量值与设计值的误差是否容许,另一方面需要用测量结果来进行生产工艺的控制。近来,在大规模集成电路和正在研制的超大规模集成电路方面,在要求图形尺寸更加微细化的同时,也对图形的尺寸精度和位置精度要求更 1. INTRODUCTION In the manufacturing processes of integrated circuits and large scale integrated circuits, it is necessary to measure the size of fine patterns formed on wafers and masks. On the one hand, it is necessary to judge whether the tolerance between the measured value and the designed value is acceptable or not, on the other hand, the measurement result needs to be used for the control of the production process. Recently, in the field of large-scale integrated circuits and ultra-large-scale integrated circuits under development, while requiring a more miniaturized graphics size, more demands are placed on the dimensional accuracy and position accuracy of the graphics